Temperature-Measurement Probe

ABSTRACT

An apparatus, system and method for temperature measurement of a target site, such a human body site. The invention includes an intelligent temperature probe configured to physically contact a target site and to communicate with a host device, which can be implemented as a hand-held device or as a personal computer. The host device can compute, store and display an accurate predicted temperature, or an actual temperature at thermal equilibrium, of the target site for each of a plurality of different intelligent temperature probes that each have unique and varied operating characteristics. A set of unique operating characteristics for each temperature probe is represented by information communicated between each respective temperature probe and the host device.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of prior U.S. patent application Ser.No. 12/650,975, filed on Dec. 31, 2009, the entire disclosure of whichis incorporated herein by reference. This patent application furtherincludes subject matter that appears related to the subject matter thatis included within U.S. Pat. No. 7,255,475, that is titled “ThermometryProbe Calibration Method”, and that was issued Aug. 14, 2007. Theaforementioned patent is herein incorporated by reference in itsentirety.

FIELD OF THE INVENTION

This invention relates to an apparatus, system and method formeasurement of a temperature of a target site, such as a human bodysite. The invention includes an intelligent probe having a set of uniqueoperating characteristics and that is configured to physically contact atarget site and to communicate with a host device that can beimplemented as a hand-held device or as a personal computer.

BACKGROUND OF THE INVENTION

A predictive thermometer includes a probe tip that is placed in physicalcontact with a target site, such as a human body site, for the purposeof measuring a temperature of that target site. A temperature of thetarget site is predicted (estimated) via real time analysis of atemperature rise of the probe tip prior to arriving at thermalequilibrium in relation to the target site. The probe tip may bepre-heated to a pre-determined temperature before temperatureestimation. Variations in the manufacture of the predictive thermometermay cause inaccuracies with respect to the estimating the temperature ofthe target site.

SUMMARY OF THE INVENTION

The invention provides for an apparatus, system and method formeasurement of a temperature of a target site, such a human body site.The invention includes an intelligent probe that is configured tophysically contact a target site and to communicate with a host devicethat can be implemented as a hand-held device or as a personal computer.The host device, such as a personal computer, can compute, store anddisplay an accurate predicted temperature, or a measured temperature atthermal equilibrium of the target site. The host device is configured tointerface with and adapt to each of a plurality of different intelligenttemperature probes that each have unique and varied operatingcharacteristics. A set of unique operating characteristics for eachtemperature probe is represented by information including a proceduralmodel that is communicated between each respective temperature probe andthe host device.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects and features of the invention can be better understood withreference to the claims and drawings described below. The drawings arenot necessarily to scale, and the emphasis is instead generally beingplaced upon illustrating the principles of the invention. Within thedrawings, like reference numbers are used to indicate like partsthroughout the various views. Differences between like parts may causethose like parts to be each indicated by different reference numbers.Unlike parts are indicated by different reference numbers.

FIG. 1A illustrates a first embodiment of a hand held and universalserial bus powered temperature-measurement probe device and a hostdevice that is implemented as a personal computer.

FIG. 1B illustrates a second embodiment of the temperature-measurementprobe that is designed to attached into a probe cradle.

FIG. 1C illustrates a third embodiment of the temperature-measurementprobe that is designed to compute and display a predicted measuredtemperature.

FIG. 2 illustrates an interior of the temperature-measurement probe ofFIGS. 1A and 1B.

FIG. 3A illustrates a conceptual block diagram of core electroniccircuitry residing within the temperature-measurement probe of FIGS. 1Aand 1B.

FIG. 3B-3E illustrate conceptual block diagrams of optional circuitryresiding within the temperature-measurement probes of FIGS. 1A and 1B.

FIG. 4A illustrates a relationship between an electrical resistance of athermistor and the temperature of that thermistor.

FIG. 4B illustrates a relationship between a temperature of thethermistor and time.

FIG. 4C illustrates an embodiment of a programming script 470 thatrepresents a procedure constructed in accordance with temperaturecorrelation information.

FIG. 5 illustrates information exchange between the temperature probe, ahost device and an electronic medical records system.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1A illustrates a first embodiment of a hand held and universalserial bus powered temperature-measurement probe device 110 and a hostdevice 150 that is implemented as a personal computer. Thetemperature-measurement probe device 110, also referred to as a device110, includes a probe portion 112, a handle portion 114, a power anddata connection cable 122 and a power and data connector 124.

The probe portion 112, also referred to as a probe body 112, is anelongated member that is designed to be placed in physical contact witha target location, such as in contact with a human body site. The probetip 112 a is preferably made from temperature sensitive material, forexample made from a metal alloy including such as stainless steel oraluminum. The probe portion 112 includes a probe tip 112 a at a distalend located farthest from the handle portion 114 of the device 110.

The handle portion 114 is designed to be held within a hand of a user ofthe device 110. As shown, the handle portion includes a plurality of oneor more visual indicators 116 a-116 c and a plurality of one or morebuttons 118 a-118 b. In some embodiments, a visual indicator 116 a-116 cis implemented as a light emitting diode (LED).

The power and data connector 124, which is also referred to as theconnector 124, is a male universal serial bus (USB) connector. The powerand data connection cable 122, also referred to as the cable 122,provides for electronic communication between the handle portion 114 andthe connector 124. In some embodiments, the connector 124 is designed toengage a female USB connector, such as the female USB connector 154 thatresides within a chassis 152 of a personal computer 150. In otherembodiments, the cable is implemented as a serial or parallel bus inaccordance with standards other than USB.

The device 110 includes a first electronic circuit path (circuitsegment) (not shown), also referred to herein as a “path”, having one ormore electrical characteristics that are sensitive to and can be mappedto a temperature of a target site, referred to as a target temperature.A circuit path (path) can be implemented as a collection of electricalcircuitry and/or other technology to achieve the functions describedherein. The first circuit path includes a thermistor that functions likean electrical resister. The electrical resistance of the thermistor is afunction of the temperature of the thermistor, while the temperature ofthe thermistor is a function of a probe temperature at a location 112 awithin the probe body. Likewise, the probe temperature is itself afunction of the target temperature. The target temperature is atemperature at a target site location (See FIG. 2), which is typically ahuman body site. In other embodiments, other temperature sensitivecomponents, such as a thermopile, are employed.

The first circuit path includes a memory that is configured to storetemperature correlation information, also referred to astemperature-correlation data. The temperature correlation informationrepresents a correlation between the electrical characteristics of thefirst circuit path and the probe temperature and a target temperature ata point in time. Circuit-measurement data represents the electricalcharacteristics of the first circuit as measured with respect to time.The circuit-measurement data typically measures the electricalcharacteristics over a period of time that is approximately 5 minutes orless in duration. In some embodiments, circuit-measurement data measuresan electrical resistance of the thermistor of the first circuit pathover time. Optionally, the memory can also store one or more instancesof circuit-measurement data in addition to the temperature-correlationdata.

The first circuit path includes at least one or more communicationsnodes (not shown) that are configured for communication of information(data) to a second circuit path (circuit segment) that resides outsideof the device 110. In the embodiment shown, the communications node (notshown) electrically connects the first circuit path with the cable 122.As a result, information stored in the memory of the first circuit pathis communicated via the communications node, the cable 122 and the USBconnector 124 to the second circuit path residing outside of the device110.

In the embodiment shown, the second circuit path (not shown) resideswithin the personal computer 150 and the information stored in memory ofthe first circuit path is further communicated to the second circuitpath through the male USB connector 124 and female USB connector 154.

The second circuit path is configured to receive the temperaturecorrelation information that is communicated from the first circuit pathof the device 110. The second circuit path is also configured to measureand/or receive the electrical characteristics (circuit-measurement data)of the first circuit path in order to perform an estimation of thetarget temperature while employing the temperature-correlation data.

In some embodiments, the temperature correlation information includes adefinition of a procedural model that correlates the electricalcharacteristics with the target temperature. The procedural modelfactors characteristics of each particular device 110 with respect toits particular design and to its particular manufacture. Thesecharacteristics include electrical and thermal characteristics of thedevice 110. Each particular manufacture of a device 110 is associatedwith manufacturing specific factors, for example, the amounts of bondingadhesives/epoxy used within the device 110 can significantly affect therate of temperature change that is being sensed by the apparatus.

In some embodiments, the probe includes a heater (See FIG. 2), alsoreferred to as a probe heater, that is located within the probe tip 112a. The probe heater is designed to generate heat in order to elevate theprobe temperature to a predetermined temperature value. Thepredetermined temperature value is selected to equal a temperature valueless than an expected target temperature value. With respect to a targetbeing a human body site, the target temperature would be expected to beequal to or greater than 98 degrees Fahrenheit. In some embodiments,when the probe temperature attains the predetermined value, a visualindicator 116 a activates to indicate a ready state for the device 110.When activating, the visual indicator 116 a-116 c projects light of apredetermined color, for example of a green color, to indicate that theprobe is fully heated to the predetermined temperature and that thedevice is ready for estimating a target temperature of a target site.Hence, one of the visual indicators 116 a-116 c can be assigned tofunction as probe heating complete indicator.

In typical use, the probe tip 112 a is placed in physical contact with atarget site and heat from the target site flows into the probe tip 112a. As the heat flows, the probe temperature increases over time. Atemperature measurement procedure inputs (samples) the probe temperatureat a predetermined frequency over time and algorithmically determines anestimated target temperature prior to the occurrence of thermalequilibrium. The estimated target temperature is also referred to as apredicted target temperature.

The temperature measurement procedure is implemented as digital logicthat resides within electronic circuitry residing within the device 110or within the host 150. In some embodiments, the digital logic isimplemented as software that is stored in the memory and that directsthe operation of a processor (CPU) 314 (See FIG. 3A). An amount of timerequired to determine a predicted target temperature is typically lessthan one minute. An amount of time required to reach thermal equilibriumtypically about 5 minutes. While determining a predicted targettemperature, the frequency of probe temperature sampling is at least onesample per second.

Upon the device 110 determining a predicted target temperature, if theprobe remains in physical contact with the target site, the probetemperature will continue to elevate until reaching thermal equilibrium.Upon reaching thermal equilibrium, the value of the probe temperatureapproximates the value of the target temperature. The value of the probetemperature at thermal equilibrium is also referred to as the manualcomplete or monitor complete temperature of the target site.

The temperature measurement procedure includes a circuit-measurementdata acquisition portion and a temperature prediction portion.Circuit-measurement data is obtained and then processed to determine anestimated (predicted) temperature of the target site 230 before reachingthermal equilibrium. In some embodiments, the device 110 activates avisual indicator 116 a-116 c to project light, optionally of aparticular color, for example of a blue color, to indicate that the dataacquisition portion of the temperature measurement procedure iscomplete. Hence, one of the visual indicators 116 a-116 c can beassigned to function as a data acquisition complete indicator.

Likewise, another visual indicator 116 a-116 c is activated to indicatethat the temperature prediction portion is complete, for embodimentswhere the probed device 110 performs temperature prediction withoutassistance of the host device 150 (See FIG. 1C). Likewise, where atemperature is measured at thermal equilibrium, another visual indicator166 a-116 c is activated to indicate that the temperature measurement atthermal equilibrium is complete. Hence, one of the visual indicators 116a-116 c can be assigned to function as a thermal equilibrium completeindicator

In some scenarios, while determining a predicted target temperature, thedevice 110 is electrically connected to the host 150 via the connectioncable 122. In this use scenario, the host 150 receives the temperaturecorrelation information from the device 110 and receives thecircuit-measurement data associated with the predicted targettemperature. The host 150 processes the circuit-measurement data incombination with the temperature correlation information in order todetermine the predicted target temperature. The predicted targettemperature is displayed via the user interface display monitor 156,also referred to as a user interface 156 or display 156.

In other use embodiments, the device 110 is charged with electricalpower that is received through the connection 122 and detached from thehost 150 and placed in physical contact with a target site. Uponobtaining sufficient circuit-measurement data to determine a predictedand/or a thermal equilibrium temperature, the device 110 is attached to,and the circuit-measurement data and temperature correlation arecommunicated to, the host 150 for determination and display of thepredicted and/or thermal equilibrium temperature.

In the above embodiments, the device 110 includes a wireline (wired)communications node (See FIG. 3A-3C)that enables the device tocommunicate with the host 150 via the connection cable 122. In otherembodiments, the device 110 instead includes a wireless communicationnode that communicates with a host 150 via a wireless communicationschannel.

FIG. 1B illustrates a second embodiment of the temperature-measurementprobe device 110 that is designed to attached into a probe cradle 154.As shown, the probe cradle 154 is electrically connected to a personalcomputer 150 via a communications cable 158. The device 110 b includes aconnector 126 that is designed to be inserted into an upper side of theprobe cradle 154. Upon being inserted, the device 110 electricallyattaches to the probe cradle 154 for transfer of power and data betweenthe host 150 and the device 110 b via a communications channelestablished by the probe cradle 154 and communications cable 158.

Digital logic residing within the device 112 detects attachment to theprobe cradle 154 and detachment from the probe cradle 154. In someembodiments, upon detachment of the device 110 b from the probe cradle154, the device 110 b can initiate the heater and/or the execution ofthe temperature prediction algorithm separate from the pressing of anybutton 118 a-118 b. Upon attachment of the device 110 b to the probecradle 154, the device 110 b communicates any circuit-measurement dataand temperature correlation information to the host 150 via the probecradle 154.

FIG. 1C illustrates a third embodiment 110 c of thetemperature-measurement probe 110 c that is designed to compute anddisplay a predicted measured temperature. As shown, a handle portion ofthe device 110 c includes a small display screen 130. The display screen130 is designed to display a predicted or thermal equilibriumtemperature as determined by the device 110 c. This embodiment of thedevice 110 c obtains the circuit-measurement data and further determinesa predicted or thermal equilibrium temperature using the temperaturecorrelation information.

In other embodiments, the host device 150 is implemented as a portablepersonal computer based device, such as a hand carriable (laptop) or asa hand held computing device. In yet other embodiments, the host device150 is implemented as a customized temperature estimation device, likethat shown as the hand held apparatus (figure reference 10) of FIG. 1 ofthe U.S. Pat. No. 7,255,475 referred to above and also referred to asthe '475 patent. As shown in the '475 patent, the probe is configured toestablish a physical connection to the temperature estimation apparatus(device). Unlike that shown in the '475 patent, the probe of theinvention described herein is connected to the hand held apparatus via auniversal serial bus connection. Like the probe of the '475 patent,probe of the invention described herein can be implemented as beingremovably attachable to the host 150 regardless of how the host 150 isimplemented.

FIG. 2 illustrates an interior view of the distal endtemperature-measurement probe of FIGS. 1A, 1B and 1C. As shown, theinterior of the distal end (tip) 112 a of the temperature-measurementprobe includes a thermistor 210 and a heater 220 that are each disposedadjacent to an inside wall of the probe tip 112 a.

The thermistor 210 functions like an electrical resister and inputselectrical current via electrical circuit segment 212 a and outputselectrical current via electrical circuit segment 212 b. The electricalresistance of the thermistor is a function of the temperature of thethermistor, and which is a function of the target temperature at thetarget site location 230. The target site location 230 is typically acollection of tissue of a human body site.

The heater 220 inputs electrical current via electrical circuit segment222 a and outputs electrical current via electrical circuit segment 222b. Electrical current passing through the heater 220 generates heat andraises the temperature of the probe tip 112 a. The heater 220 operatesuntil the thermistor 210 indicates that the temperature of thethermistor 210 has arrived at a predetermined target temperature.

FIG. 3A illustrates a conceptual block diagram of core electroniccircuitry residing within the temperature-measurement probe 112 of FIGS.1A-1C and 2. As shown, a central processing unit (CPU) 314, alsoreferred to as a processor 314, is attached to a system bus 312. Thesystem bus enables the CPU 314 to interface with other components thatare also attached to the system bus 312. These other components includea switch interface 316, a visual/audio interface 318, a power interface320, a communications interface 322, a memory 324, a heater interface326, an analog to digital (A/D) converter 328 and a thermistor interface330.

The switch interface 316 is designed to detect and communicate an eventassociated with the device 110. For example, the switch interface 316detects a button press event associated with at least one button 118a-118 b. Also, the switch interface 316 detects an attachment ordetachment event between the device 110 and the cradle 154. The device110 can be configured to take action, such as initiate operation of theheater 220 or to initiate execution of the temperature predictionalgorithm, upon the press of a button 118 a-118 b or upon detachment ofthe device from the cradle 154. Initiation of electrical charging of thedevice 110 occurs upon attachment of the device to the cradle 154.

The visual/audio interface 318 is designed to communicate with the userof the device 110. For example, if and when operation of the heater 220is initiated, a visual and/or audio indication is communicated to theuser. In some embodiments, a light emitting diode 116 a-116 c emitslight to indicate operation of the heater 220. Optionally, an audiblesound is emitted to indicate the operation of the heater 220. Likewise,a visual and/or audio indication is communicated to the user to indicatearrival of the device 110 at a target temperature, termination of theheater 220 operation, determination of a predicted temperature and/ordetermination of a thermal equilibrium temperature.

The communication interface 322 enables communication of informationbetween the device 110 and the host 150. The communication can be viathe connection cable 122, via the cradle 154 (if applicable) or via awireless communication channel (if applicable). The information that iscommunicated includes the temperature correlation information andcircuit-measurement data.

The communications interface acts as an interface to a communicationsnode. In some embodiments, the communications node is implemented tocommunicate via a wireline communications channel, such as implementedwith universal serial bus (USB) technology. In other embodiments, thecommunications node is implemented to communicate via a wirelesscommunications channel, and is implemented via wireless communicationtechnology, that is designed in accordance with IEEE 802.11, IEEE 802.15or Zigbee 802.15.4 communication standards, for example.

The memory 324 stores the temperature correlation information andcircuit-measurement data along with software. The software includes CPUinstructions and data that control the operation of the device 110. Thesoftware directs the CPU 314 to send commands to, and to receive statusinformation from, the other components that are attached to the systembus 312.

The power interface 320 supplies electrical power to the device 110. Theelectrical power can be supplied via the connection cable 122, via thecradle 154 (if applicable) or via a capacitor (not shown). Embodimentsthat include a capacitor enable charge of the capacitor while attachedto the host 150 via the connection cable 122 or attached to the host viathe cradle 154. The capacitor enables the device 110 to be powered whiledetached from the host 150 and the cradle 154 (if applicable).

The heater interface 326 enables the CPU 314 to control operation of theheater 220. In some embodiments, the heater interface 326 is enabled asa port within a single chip microcomputer. The CPU 314 writes commandsinto a port register that directs heater interface circuitry to supplycurrent to the heater 220. The heater 220 generates heat in order toraise the temperature of the probe 122 until it arrives a predeterminedtemperature.

The thermistor interface 330 enables the CPU 314 to control operation ofthe thermistor 210. In some embodiments, the thermistor interface 330 isenabled as a port within a single chip microcomputer. The CPU 314 writescommands into a port register that directs thermistor interfacecircuitry to supply a fixed electrical current to, or fixed voltageacross, the thermistor 210.

In some embodiments, the thermistor interface 330 supplies a fixedcurrent to the thermistor 210. An analog to digital converter 328 whileinteroperating with the thermistor interface 330, is used to measure adifferential voltage across the thermistor 210. The amount of currentflowing through the thermistor 210 in combination with the measureddifferential voltage is used to determine the resistance(Resistance=Voltage/Current) of the thermistor 210 at a point in time.

In other embodiments, the thermistor applies a fixed voltage across thethermistor 210 in order to measure the electrical current passingthrough the thermistor 210. A measured amount of electrical currentflowing through the thermistor 210, in combination with the fixedvoltage, indicates the resistance of the thermistor 210 at a point intime.

Some embodiments of the invention do not include all of theaforementioned components.

FIG. 3B-3E illustrate conceptual block diagrams of embodiments of powerand communications circuitry for the temperature-measurement probedevice 110.

FIG. 3B illustrates an embodiment of the device 110 that is powered viaa universal serial bus (USB) interface 340. The USB interface 340includes electronic circuitry that resides within the device 110 andthat is electrically attachable to the host 150 via the USB connectioncable 122. The USB interface 340, also referred to as the USB hardware340, is designed to transfer electrical power and data between thedevice 110 and the host 150 while electrically attached to the host 150via the USB connection cable 122. Electrical power transfers from thehost 150 via the connection cable 122 to the USB interface component340. Data is transferred from the device 110 via the USB interfacecomponent 340 and via the USB connection cable 122 to the host 150, andfrom the host 150 to the device 110 via the same electrical path.

FIG. 3C illustrates the embodiment of FIG. 3B further including anelectrical capacitor 346. The capacitor 346 enables the device 110 tooperate while being electrically detached from the host device 150.Electrical power that is supplied via the USB interface 340 is employedto supply electrical charge to the capacitor 346. Upon supplying asufficient electrical charge to the capacitor 346, the device 110 isdetached from the host device 150 via detachment of the USB connectioncable 122 from the host device 150. The user of the probe device 150 isthen free to move the device 110 farther away from the host device 150in order to physically contact the device 110 with a target siteassociated with a human target. Electrical charge stored within thecapacitor 346 enables the device 110 to perform heating and to, atleast, gather circuit-measurement data during physical contact with atarget-set location. The device 110 can further perform a predictedtemperature or thermal equilibrium temperature determination.

In some use scenarios, the device 110 can obtain multiple sets ofcircuit-measurement data associated with multiple physical contacts withone target or with multiple targets before re-attaching the probe deviceto the host device 150. The circuit-measurement data, in combinationwith the temperature-correlation data, is transferred to the host devicefor storage and processing into one or more temperature values. Thosetemperature values may be predicted and/or at thermal equilibrium.

FIG. 3D illustrates the embodiment of FIG. 3C further including awireless communications node 350. The wireless communications node 350enables the device 110 to communicate with the host device 150 withoutbeing electrically attached to the host device via the connection cable122. The capacitor 346 supplies electrical power to the wirelesscommunications node 350 via the power interface 320. In someembodiments, the wireless communications node 350 establishes a wirelesscommunications channel with the host device 150 in accordance with IEEE802.11, IEEE 802.15 and Zigbee 802.15.4 communication standards.

FIG. 3E illustrates an embodiment of the device 110 that includes abattery 348 and a wireless communications node. Like the prior describedembodiment of FIGS. 3C-3D, the battery enables the device 110 to be usedin a portable manner. Unlike the prior described embodiments, thisembodiment does not necessarily require a USB interface 340 to receiveelectrical power from another device. The battery can be pre-charged andinstalled into the device 110. This feature enables the device 110 tohave electrical power without a cable connection, such as a USB cable122 connection with another device, such as the host device 150.

FIG. 4A illustrates a functional relationship 410 between an electricalresistance 414 of an embodiment of a thermistor 210 and the temperature412 of the thermistor 210. The electrical resistance 414 is measured inohms and temperature is measured in, for example, degrees Fahrenheit.The thermistor 210 is classified as operating in accordance with anegative temperature coefficient, meaning that the electrical resistance414 of the thermistor 210 decreases as a function of its risingtemperature 412. In other words, the higher the thermistor's temperature412 the lower its electrical resistance 414 and the lower thethermistor's temperature 412 the higher its electrical resistance 414.

In other embodiments of the thermistor 210, the thermistor 210 canoperate in accordance with a different temperature coefficient than thatof the embodiment of the thermistor 210 that is associated with therelationship 410 shown. Operating in accordance with a differenttemperature coefficient would result in a different functionalrelationship between the other thermistor's temperature 412 and itselectrical resistance 414. Such a temperature coefficient could equal avalue that is negative (below 0.0) or in some circumstances a positivevalue (above 0.0).

FIG. 4B illustrates a relationship 420 between a temperature 412 of thethermistor 210 and time 416. As shown, physical engagement of the probetip 112 a to a target site 230 having a temperature that is higher thanthat of the probe tip 112 a, causes transfer of heat from the targetsite 230 to the probe tip 112 a and causes an increase over a period oftime 424 to the temperature 412 of the probe tip 112 a and to thetemperature 412 of the thermistor 220 within the probe tip 112 a. Thetemperature of the probe tip 112 a and the temperature 412 of thethermistor 210 eventually rise to an equilibrium temperature value 428that is slightly less than or equal to the temperature of the targetsite 230.

As shown, the thermistor temperature 412 equals a lower temperaturevalue 422 at time 416 a and then substantially rises during a period oftime 424, that is referred to as a dynamic rise time period 424. Thedynamic rise time period 424 includes instances (points) in time 416a-416 e that are each respectively associated with a temperature value412 a-412 e of the thermistor. The dynamic rise time period 424eventually terminates upon arriving at a thermal equilibrium temperature428 which occurs at time 416 f.

Combining the relationship illustrated in each of FIGS. 4A-4B, it isapparent that the resistance value of the thermistor 220 substantiallydecreases during the dynamic temperature rise time period 424 while theprobe tip 112 a is placed in physical contact to the target 230. Therelationship between the electrical resistance value of the thermistor220 over a period of time is recorded within circuit-measurement data.

The circuit-measurement data represents measurement of electricalcharacteristics of the first circuit path, including and/or indicatingthe resistance value 414 of the thermistor 220, as a function of time416 and over period of time including at least a portion of the dynamicrise time 424. Temperature correlation information is employed toexecute a procedure that inputs information provided by thecircuit-measurement data in order to determine an estimated (predicted)temperature value of the target site 230.

The temperature correlation information provides a mapping of electricalresistance of the thermistor to a temperature of the thermistor as shownin FIG. 4A. In combination with the circuit measurement data (thermistorelectrical resistance versus time data), the temperature of thethermistor versus time is determined as shown in FIG. 4B.

The temperature correlation information further includes informationmapping a thermistor temperature versus time to a predicted (estimated)thermistor temperature at thermal equilibrium, and further includesinformation that maps a predicted thermistor temperature at thermalequilibrium to a probe temperature at thermal equilibrium and furtherincludes information to map the probe temperature at thermal equilibriumto a target temperature.

FIG. 4C illustrates an embodiment of programming script 470 thatrepresents a procedure, also referred to as a procedural model, that isconstructed in accordance with temperature correlation information. Thescript 470 is a collection of digital logic that defines a procedure forprocessing the circuit-measurement data. The script 470 is expressed asa set of directives like that of a computer programming language and isdesigned to exercise, at least in part, a relationship betweencircuit-measurement data and an estimated (predicted) temperature of thetarget site 230. The circuit-measurement data is associated with aparticular points in time within a period of time within which thecircuit-measurement data is collected. The circuit-measurement datacollection is initiated before time period 424 and terminated after timeperiod 424.

As shown, this embodiment of script 470 employs a syntax like that ofthe C programming language. The script 470 defines a procedure namedTemp_predict_procedure( ) 472 which is stored in the memory 324 of anembodiment of the device 110. This procedure is employed to determine anestimated (predicted) temperature of a target site 230 that is inphysical contact with that embodiment of the device 110. The procedureaccesses the circuit-measurement data that was collected by the device110 while it was in physical contact with the target site 230. In someembodiments, the circuit-measurement data is accessed via a library offunction calls, such as the cmd_temp( ) function call 478 that isemployed in this script 470.

As shown, this procedure defines and sets initial values for (8) scriptvariables. Of these script variables, (4) variables 474 a-474 d areemployed as constant numerical coefficient values within a mathematicalexpression 480 that is exercised within the procedure to determine avalue of the Temp_predict variable. The procedure 470 returns (outputs)the predicted (estimated) temperature by returning theTemp_predict_variable 482.

Of these script variables, (3variables 476 b-476 d are employed asvalues that are each passed as a parameter to a cmd_temp( ) function 478a-478 c. The cmd_temp( ) function 478 a-478 c extracts a temperaturevalue from circuit-measurement data (CMD) that is associated with a timevalue (476 b-476 d) that is passed to it as a parameter. The timeparameter is an offset (in seconds) within a period of time within whichcircuit measurement data collection occurs.

For example, cmd_temp (1.75) returns a temperature value at a point intime occurring in time 1.75 seconds after the initiation of thecircuit-measurement data collection time period. Another function,cmd_time(temperature value) (not shown here) returns a time for a firstand if applicable, next occurrence of a temperature value measuredwithin the circuit-measurement data collection time period.

Other embodiments of script can obtain and process additionaltemperature values at different points in time from thecircuit-measurement data (CMD). Furthermore, other embodiments of thescript can employ other C programming constructs such a IF, ELSE andELSE IF statements to more conditionally process circuit-measurementdata (CMD) based upon values retrieved from the CMD.

Note that values of script variables, factor a difference between atemperature of the thermistor and an estimated temperature of the targetsite 230, based upon known design and manufacturing characteristics ofthe particular device 110 that is associated with and stores the scriptprocedure 470.

An advantage of this approach is that each separately designed andmanufactured device 110 can store and communicate its own customizedscript to a host device 150. Each customized script reflects design andmanufacturing idiosyncrasies of each probed device 110. If newer and/ormore effective scripts are developed in association with a particulardevice 110, then that newer script can be stored onto that particulardevice 110 and later exercised (executed) by a host device 150, in orderto quickly and accurately predict a temperature of a target site 230 inphysical contact with the device 110.

In accordance with the invention, via employment of a script,temperature prediction is no longer limited to an exercise of any oneprocedure or mathematical model that is associated with such aprocedure. Entirely different procedures and/or mathematical models canbe developed and exercised for a same device 110 or each customized foreach of a set of different probe devices 110.

For example, a temperature estimation procedure can be upgraded andrefined over time for a particular manufactured device 110, or for aclassification of like designed probe devices, and varied fordifferently designed probe devices 110. Furthermore, a host device 150will be able to perform temperature estimation for devices 110 that aredesigned and or manufactured after a commercial release of the hostdevice 150.

FIG. 5 illustrates information exchange between the temperature probe110, a host device 150 and an electronic medical records (EMR) system500. The EMR system includes a repository of information (data) 502 thatis implemented in some embodiments as a data base 502. Temperaturemeasurements performed by the device 110 are communicated to and storedinto the EMR system 500.

The host device 150 is designed to associate patient and time ofmeasurement information with temperature measurements performed by thedevice 110. In some embodiments, the probe device performs bothcircuit-measurement data collection and temperature prediction, whichare both communicated to the host device 150 from the device 110. Inother embodiments, the device 110 performs circuit-measurement datacollection that is communicated to the host device 150 from the device110.

What is claimed is:
 1. A temperature-measurement device, comprising: afirst device having a first electronic circuit, a communication node,and a memory storing a first mathematical expression, the firstelectronic circuit measuring electrical characteristics; and a hosthaving a second electronic circuit and a communication channel forcommunication with the node and to receive the first mathematicalexpression and the electrical characteristics from the first electroniccircuit, and wherein the host can exercise the first mathematicalexpression and utilize a portion of the measured electricalcharacteristics to determine a temperature, and wherein the host canexercise a second mathematical expression in a second deviceinterchangeable with the first device, the second mathematicalexpression having programming constructs different from the firstmathematical expression.
 2. The temperature-measurement device of claim1, wherein the first electronic circuit includes at least one of aresistor, a thermistor, and a thermopile.
 3. The temperature-measurementdevice of claim 1, wherein the first mathematical expression is at leastone of a script, computer programming language directives, and digitallogic.
 4. The temperature-measurement device of claim 1, wherein thecommunication channel is a wireless channel.
 5. Thetemperature-measurement device of claim 1, wherein the second electroniccircuit is part of a temperature-estimation device.
 6. Thetemperature-measurement device of claim 1, wherein the first device canbe associated with a cradle.
 7. The temperature-measurement device ofclaim 1, wherein the first device includes an adhesive.
 8. Thetemperature-measurement device of claim 1, wherein the device includes adata acquisition complete indicator.
 9. The temperature-measurementdevice of claim 1, wherein the first electronic circuit performsacquisition and storage of the electrical characteristics while thedevice is located in physical contact with a target.
 10. Thetemperature-measurement device of claim 1, wherein the temperatureapproximates a temperature of a human body site.
 11. A system configuredto determine a temperature of a patient, comprising: a first devicehaving a first electronic circuit, a communication node, and a memorystoring a first mathematical expression, the first electronic circuitmeasuring electrical characteristics; and a host having a secondelectronic circuit and a communication channel for communication withthe node and to receive the first mathematical expression and theelectrical characteristics from the first electronic circuit, whereinthe host can exercise the first mathematical expression and utilize aportion of the measured electrical characteristics to determine atemperature, and wherein the host can exercise a second mathematicalexpression in a second device changeable with the first device, thesecond mathematical expression having programming constructs differentfrom the first mathematical expression.
 12. The system of claim 11,further comprising an electronic medical records system wherein thetemperature is recorded in the electronic medical records system. 13.The system of claim 12, wherein the electronic medical records systemincludes a repository.
 14. The system of claim 11, wherein the secondelectronic circuit associates at least one of patient information andtime information with the temperature.
 15. The system of claim 14,further comprising an electronic medical records system wherein thetemperature and the at least one of patient information and timeinformation is recorded in the electronic medical records system.
 16. Amethod of manufacturing a temperature measurement device, comprising:providing a first device having a first electronic circuit, acommunication node, and a memory; storing a first mathematicalexpression in the memory; configuring the first electronic circuit tomeasure electrical characteristics; providing a host having a secondelectronic circuit and a communication channel for communication withthe node and to receive the first mathematical expression and theelectrical characteristics; configuring the host to exercise the firstmathematical expression by utilizing a portion of the measuredelectrical characteristics to determine a temperature; configuring thehost to exercise a second mathematical expression in a second deviceswitchable with the first device, the second mathematical expressionhaving programming constructs different from the first mathematicalexpression
 17. The method of claim 16, further comprising configuringthe second electronic circuit to communicate the temperature to anelectronic medical records system.
 18. The method of claim 16, whereinthe first mathematical expression includes a first set of designcharacteristics and the second mathematical expression includes a secondset of design characteristics.
 19. The method of claim 16, furthercomprising providing the second device with the second mathematicalexpression.
 20. The method of claim 16, wherein the host includes acradle, and wherein the first device is configured to communicate withthe channel after the first device is associated with the cradle.